P-THERM® Gap Fillers
Polymer Science offers a variety of thermally conductive gap filler pad materials in silicone and non-silicone formulations. P-THERM® gap filler materials offer a range of thermal conductivities, hardnesses and thicknesses. P-THERM® gap filler materials have been designed to achieve desired heat management properties to keep components at optimized operating temperatures in today’s advanced electronics designs.
Characteristics of P-THERM® Gap Fillers