P-THERM® Thermal Management Materials
P-THERM® thermal management materials are designed to efficiently and effectively aid in the conduction of heat to meet the growing thermal management requirements of today’s smaller electronic designs. Our diverse offering of materials provide solutions to many bonding applications that increase reliability and decrease production costs.
P-THERM® gap filler materials have been designed to achieve desired heat management properties to keep components at optimized operating temperatures in today’s advanced electronics designs.
P-THERM® ECIs offer good dielectric and thermally conductive properties without the worry of flow from wax-based products or mess associated with thermal grease.